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The wing in yeast heat shock transcription factor (HSF) DNA-binding domain is required for full activity

机译:酵母热激中的机翼 转录因子(HSF)DNA结合结构域是完整的所需 活动

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摘要

The yeast heat shock transcription factor (HSF) belongs to the winged helix family of proteins. HSF binds DNA as a trimer, and additional trimers can bind DNA co-operatively. Unlike other winged helix–turn–helix proteins, HSF’s wing does not appear to contact DNA, as based on a previously solved crystal structure. Instead, the structure implies that the wing is involved in protein–protein interactions, possibly within a trimer or between adjacent trimers. To understand the function of the wing in the HSF DNA-binding domain, a Saccharomyces cerevisiae strain was created that expresses a wingless HSF protein. This strain grows normally at 30°C, but shows a decrease in reporter gene expression during constitutive and heat-shocked conditions. Removal of the wing does not affect the stability or trimeric nature of a protein fragment containing the DNA-binding and trimerization domains. Removal of the wing does result in a decrease in DNA-binding affinity. This defect was mainly observed in the ability to form the first trimer-bound complex, as the formation of larger complexes is unaffected by the deletion. Our results suggest that the wing is not involved in the highly co-operative nature of HSF binding, but may be important in stabilizing the first trimer bound to DNA.
机译:酵母热激转录因子(HSF)属于有翼螺旋蛋白家族。 HSF结合DNA作为三聚体,其他三聚体可以协同结合DNA。与其他有翼螺旋-转-螺旋蛋白不同,HSF的翼似乎不接触DNA,这是基于先前解析的晶体结构。相反,该结构暗示机翼可能参与三聚体内部或相邻三聚体之间的蛋白质间相互作用。为了了解机翼在HSF DNA结合域中的功能,创建了表达无翼HSF蛋白的酿酒酵母菌株。该菌株通常在30°C下生长,但在组成型和热激条件下,报告基因的表达下降。去除翼不影响包含DNA结合和三聚结构域的蛋白质片段的稳定性或三聚体性质。移除机翼确实会导致DNA结合亲和力下降。该缺陷主要在形成第一个三聚体结合的复合物的能力中观察到,因为较大的复合物的形成不受缺失的影响。我们的结果表明,该机翼不参与HSF结合的高度合作性质,但在稳定与DNA结合的第一个三聚体中可能很重要。

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